Thermal Transient Test Based Thermal Structure Function Analysis of IGBT Package

Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT

The paper will give a detailed presentation of an active power cycling test bench in high temperature conditions developed to ageing the solder between the Direct Copper Bonding (DCB) and the base of IGBT devices. The average junction temperature measurement protocol, the temperature regulation of the base plate, the acquisition of all the electrical signals, and the performance of the test cir...

Thermal Analysis of Turbocharger Steel Gasket via Experimental Test

Increasing the power (torque) of nowadays engines, along with reduction of fuel consumption and dimensions of them, cause to the use of turbocharged systems. Since turbo chargers are exposed to the exhaust hot gases and have a high operating speed, it is necessary to utilize high technology design and special materials with high cost. The temperature of the exhaust system with gasoline fuel som...

Transient Thermal Stresses Analysis in a FPGM Cylinder

The present study aims to investigate the analysis of stress, strain, displacement, and electrical potential of a thick hollow cylinder made of FGPM under mechanical and thermal loads. Distribution of mechanical property of material is considered along the shell stick through the power distribution function. Thermal loads have been taken to signify the difference of temperature between outer an...

A physics-based electro-thermal model for FS IGBT

Package Thermal Characterization

Effective heat removal from the IC chip, through the package, to the adjacent environment is crucial to maintain an allowable device junction temperature. The latter directly affects the electrical circuit performance both at the component and system levels. Aside from thermal enhancement of individual packages by the IC manufacturers, proper printed circuit board (PCB) layout and cabinet desig...